| Certification: | RoHS, ISO |
|---|---|
| Encapsulation Structure: | Chip Transistor |
| Installation: | Plug-in Triode |
| Shipping Cost: | Contact the supplier about freight and estimated delivery time. |
|---|
Suppliers with verified business licenses
Audited by an independent third-party inspection agency
General Description
| Parameter | Value | Unit |
| VDS | 150 | V |
| ID, pulse | 400 | A |
| RDS(ON), max@VGS=10V | 11 | mΩ |
| Qg | 21 | nC |
| ProductName | Package | Marking |
| SFS15R11UGNF | PDFN5×6 | SFS15R11UGN |
| Parameter | Symbol | Value | Unit |
| Drain-source voltage | VDS | 150 | V |
| Gate-source voltage | VGS | ±20 | V |
| Continuous drain current1), TC=25 °C | ID | 100 | A |
| Pulsed drain current2), TC=25 °C | ID, pulse | 400 | A |
| Continuous diode forward current1), TC=25 °C | IS | 100 | A |
| Diode pulsed current2), TC=25 °C | IS, pulse | 400 | A |
| Power dissipation3),TC=25°C | PD | 205 | W |
| Single pulsed avalanche energy5) | EAS | 94 | mJ |
| Operation and storage temperature | Tstg,Tj | -55 to 150 | °C |
| Parameter | Symbol | Value | Unit |
| Thermal resistance, junction-case | RθJC | 0.61 | °C/W |
| Thermal resistance, junction-ambient4) | RθJA | 62 | °C/W |
| Parameter | Symbol | Min. | Typ. | Max. | Unit | Test condition |
| Drain-source breakdown voltage |
BVDSS | 150 | V | VGS=0 V, ID=250 μA | ||
| Gate threshold voltage |
VGS(th) | 2.5 | 4.5 | V | VDS=VGS, ID=250 μA | |
| Drain-source on- stateresistance |
RDS(ON) | 8.8 | 11 | mΩ | VGS=10 V, ID=50A | |
| Gate-source leakage current |
IGSS | 100 | nA | VGS=20V | ||
| -100 | VGS=-20V | |||||
| Drain-source leakage current |
IDSS | 1 | μA | VDS=150V, VGS=0 V | ||
| Gate resistance | RG | 4.2 | Ω | ƒ=1 MHz, Open drain |
| Parameter | Symbol | Min. | Typ. | Max. | Unit | Test condition |
| Input capacitance | Ciss | 1308 | pF | VGS=0 V, VDS=25V, ƒ=100 kHz |
||
| Output capacitance | Coss | 1576 | pF | |||
| Reverse transfer capacitance | Crss | 63 | pF | |||
| Turn-on delay time | td(on) | 12 | ns | VGS=10 V, VDS=80V, RG=2 Ω, ID=40A |
||
| Rise time | tr | 10 | ns | |||
| Turn-off delay time | td(off) | 23 | ns | |||
| Fall time | tf | 10 | ns |
| Parameter | Symbol | Min. | Typ. | Max. | Unit | Test condition |
| Totalgate charge | Qg | 21 | nC | VGS=10 V, VDS=80V, ID=40A |
||
| Gate-source charge | Qgs | 7 | nC | |||
| Gate-drain charge | Qgd | 8 | nC | |||
| Gate plateau voltage | Vplateau | 6 | V |
| Parameter | Symbol | Min. | Typ. | Max. | Unit | Test condition |
| Diode forward voltage | VSD | 1.3 | V | IS=20A, VGS=0 V |
||
| Reverse recovery time | trr | 53 | ns | VR=80V, IS=40A, di/dt=400 A/μs |
||
| Reverse recovery charge | Qrr | 281 | nC | |||
| Peak reverse recovery current | Irrm | 8 | A |





