| Certification: | RoHS, ISO |
|---|---|
| Encapsulation Structure: | Chip Transistor |
| Installation: | Plug-in Triode |
| Shipping Cost: | Contact the supplier about freight and estimated delivery time. |
|---|
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General Description
| Parameter | Value | Unit |
| VDS | 150 | V |
| ID, pulse | 920 | A |
| RDS(ON), max@VGS=10V | 4.6 | mΩ |
| Qg | 68.8 | nC |
| ProductName | Package | Marking |
| SFS15R046TNF | TOLL | SFS15R046TN |
| Parameter | Symbol | Value | Unit |
| Drain-source voltage | VDS | 150 | V |
| Gate-source voltage | VGS | ±20 | V |
| Continuous drain current1), TC=25 °C | ID | 230 | A |
| Pulsed drain current2), TC=25 °C | ID, pulse | 920 | A |
| Continuous diode forward current1), TC=25 °C | IS | 230 | A |
| Diode pulsed current2), TC=25 °C | IS, pulse | 920 | A |
| Power dissipation3),TC=25°C | PD | 555 | W |
| Single pulsed avalanche energy5) | EAS | 1248 | mJ |
| Operation and storage temperature | Tstg, Tj | -55 to 175 | °C |
| Parameter | Symbol | Value | Unit |
| Thermal resistance, junction-case | RθJC | 0.27 | °C/W |
| Thermal resistance, junction-ambient4) | RθJA | 62.5 | °C/W |
| Parameter | Symbol | Min. | Typ. | Max. | Unit | Test condition |
| Drain-source breakdown voltage |
BVDSS | 150 | V | VGS=0 V, ID=250 μA | ||
| Gate threshold voltage |
VGS(th) | 3 | 4.5 | V | VDS=VGS, ID=250 μA | |
| Drain-source on-state resistance |
RDS(ON) | 3.7 | 4.6 | mΩ | VGS=10 V, ID=30A | |
| Gate-source leakage current |
IGSS | 100 | nA | VGS=20 V | ||
| -100 | VGS=-20 V | |||||
| Drain-source leakage current |
IDSS | 1 | μA | VDS=150 V, VGS=0 V | ||
| Gate resistance | RG | 3.8 | Ω | ƒ=1 MHz, Open drain |
| Parameter | Symbol | Min. | Typ. | Max. | Unit | Test condition |
| Input capacitance | Ciss | 5358 | pF | VGS=0 V, VDS=80V, ƒ=100 kHz |
||
| Output capacitance | Coss | 1737 | pF | |||
| Reverse transfer capacitance | Crss | 25.9 | pF | |||
| Turn-on delay time | td(on) | 24.4 | ns | VGS=10 V, VDS=80V, RG=2 Ω, ID=30A |
||
| Rise time | tr | 16 | ns | |||
| Turn-off delay time | td(off) | 51.2 | ns | |||
| Fall time | tf | 17 | ns |
| Parameter | Symbol | Min. | Typ. | Max. | Unit | Test condition |
| Totalgate charge | Qg | 68.8 | nC | VGS=10 V, VDS=80V, ID=30A |
||
| Gate-source charge | Qgs | 26.5 | nC | |||
| Gate-drain charge | Qgd | 12.9 | nC | |||
| Gate plateau voltage | Vplateau | 5.4 | V |
| Parameter | Symbol | Min. | Typ. | Max. | Unit | Test condition |
| Diode forward voltage | VSD | 1.3 | V | IS=30A, VGS=0 V |
||
| Reverse recovery time | trr | 130 | ns | VR=80V, IS=30A, di/dt=100 A/μs |
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| Reverse recovery charge | Qrr | 140 | nC | |||
| Peak reverse recovery current | Irrm | 2.6 | A |





