Certification: | RoHS, ISO |
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Encapsulation Structure: | Plastic Sealed Transistor |
Installation: | Plug-in Triode |
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General Description
The GreenMOS® high voltage MOSFET utilizes charge balance technology to achieve outstanding low on-resistance and lower gate charge. It is engineered to minimize conduction loss, provide superior switching performance and robust avalanche capability.General Description The GreenMOS® high voltage MOSFET utilizes charge balance technology to achieve outstanding low on-resistance and lower gate charge. It is engineered to minimize conduction loss, provide superior switching performance and robust avalanche capability. The GreenMOS® Z series is integrated with fast recovery diode (FRD) to minimize reverse recovery time. It is suitable for resonant switching topologies to reach higher efficiency, higher reliability and smaller form factor. Features . Low RDS(ON) & FOM . Extremely low switching loss . Excellent stability and uniformity Applications . LED lighting . Adapter . Telecom . Solar/UPS . Sever Key Performance Parameters
Marking Information
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Parameter | Symbol | Value | Unit |
Drain-source voltage | VDS | 600 | V |
Gate-source voltage | VGS | ±30 | V |
Continuous drain current1) , TC=25 °C | ID |
52 | A |
Continuous drain current1) , TC=100 °C | 32.8 | ||
Pulsed drain current2) , TC=25 °C | ID, pulse | 156 | A |
Continuous diode forward current1) , TC=25 °C | IS | 52 | A |
Diode pulsed current2) , TC=25 °C | IS, pulse | 156 | A |
Power dissipation3) , TC=25 °C | PD | 440 | W |
Single pulsed avalanche energy4) | EAS | 486 | mJ |
MOSFET dv/dt ruggedness, VDS=0…480 V | dv/dt | 50 | V/ns |
Reverse diode dv/dt, VDS=0…480 V, ISD≤ID | dv/dt | 50 | V/ns |
Operation and storage temperature | Tstg, Tj | -55 to 150 | °C |
Parameter | Symbol | Value | Unit |
Thermal resistance, junction-case | RθJC | 0.28 | °C/W |
Thermal resistance, junction-ambient | RθJA | 62 | °C/W |
Parameter | Symbol | Min. | Typ. | Max. | Unit | Test condition |
Drain-source breakdown voltage |
BVDSS | 600 | V | VGS=0 V, ID=1 mA | ||
Gate threshold voltage |
VGS(th) | 3.0 | 5.0 | V | VDS=VGS , ID=1 mA | |
Drain-source on-state resistance |
RDS(ON) |
52 | 58 | mΩ |
VGS=10 V, ID=26 A | |
129 | VGS=10 V, ID=26 A, Tj=150 °C |
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Gate-source leakage current |
IGSS |
100 | nA |
VGS=30 V | ||
- 100 | VGS=-30 V | |||||
Drain-source leakage current |
IDSS | 10 | μA | VDS=600 V, VGS=0 V | ||
Gate resistance | RG | 2 | Ω | ƒ=1 MHz, Open drain |
Parameter | Symbol | Min. | Typ. | Max. | Unit | Test condition |
Input capacitance | Ciss | 4257 | pF | VGS=0 V, VDS=50 V, ƒ=100 kHz |
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Output capacitance | Coss | 210 | pF | |||
Reverse transfer capacitance | Crss | 3 | pF | |||
Effective output capacitance, energy related | Co(er) | 181 | pF | VGS=0 V, VDS=0 V-400 V |
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Effective output capacitance, time related | Co(tr) | 783 | pF | |||
Turn-on delay time | td(on) | 30 | ns | VGS=10 V, VDS=400 V, RG=5 Ω, ID=40 A |
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Rise time | tr | 88 | ns | |||
Turn-off delay time | td(off) | 65 | ns | |||
Fall time | tf | 4 | ns |
Parameter | Symbol | Min. | Typ. | Max. | Unit | Test condition |
Total gate charge | Qg | 83 | nC | VGS=10 V, VDS=400 V, ID=40 A |
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Gate-source charge | Qgs | 27 | nC | |||
Gate-drain charge | Qgd | 29 | nC | |||
Gate plateau voltage | Vplateau | 7.4 | V |
Parameter | Symbol | Min. | Typ. | Max. | Unit | Test condition |
Diode forward voltage | VSD | 1.3 | V | IS=52 A, VGS=0 V |
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Reverse recovery time | trr | 172 | ns | VR =400 V, IS=40 A, di/dt=100 A/μs |
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Reverse recovery charge | Qrr | 911 | nC | |||
Peak reverse recovery current | Irrm | 9.2 | A |