Vienna Topology Vds, High Voltage Power Mosfet

Product Details
Certification: RoHS, ISO
Shape: Metal Porcelain Tube
Shielding Type: Sharp Cutoff Shielding Tube
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Registered Capital
10000000 RMB
Plant Area
501~1000 square meters
  • Vienna Topology Vds, High Voltage Power Mosfet
  • Vienna Topology Vds, High Voltage Power Mosfet
  • Vienna Topology Vds, High Voltage Power Mosfet
  • Vienna Topology Vds, High Voltage Power Mosfet
  • Vienna Topology Vds, High Voltage Power Mosfet
  • Vienna Topology Vds, High Voltage Power Mosfet
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  • Overview
  • Product Description
Overview

Basic Info.

Model NO.
OSG65R035HTF TO247
Cooling Method
Air Cooled Tube
Function
Switch Transistor
Working Frequency
High Frequency
Structure
Planar
Encapsulation Structure
Plastic Sealed Transistor
Power Level
Medium Power
Material
Silicon
Description
Extremely Low Switching Loss
Characteristics
Excellent Stability and Uniformity
Applications
PC Power
Industries
LED Lighting
Type
Fast EV Charging Station
Warranty
24 Months
Transport Package
Carton
Specification
TO247
Trademark
Orientalsemiconductor
Origin
China
HS Code
854129000
Production Capacity
20K/Monthly

Packaging & Delivery

Package Size
59.00cm * 34.00cm * 15.00cm
Package Gross Weight
19.000kg

Product Description

Product Description

 


General Description
The GreenMOS® high voltage MOSFET utilizes charge balance technology to achieve outstanding low on-resistance and lower gate charge. It is engineered to minimize conduction loss, provide superior switching performance and robust avalanche capability.
The GreenMOS® Generic series is optimized for extreme switching performance to minimize switching loss. It is tailored for high power density applications to meet the highest efficiency standards.

Features                                                                                                   
  • Low RDS(on) & FOM
  • Extremely low switching loss
  • Excellent stability and uniformity

Applications
  • PC power
  • LED lighting
  • Telecom power
  • Server power
  • EV Charger
  • Solar/UPS
  •  
  • Key Performance Parameters
  •  
    Parameter Value Unit
    VDS, min @ Tj(max) 700 V
    ID, pulse 240 A
    RDS(ON) , max @ VGS=10V 35
    Qg 153.6 nC

    Marking Information
     
    Product Name Package Marking
    OSG65R035HTF TO247 OSG65R035HT
Absolute Maximum Ratings at Tj=25°C unless otherwise noted
 
Parameter Symbol Value Unit
Drain-source voltage VDS 650 V
Gate-source voltage VGS ±30 V
Continuous drain current1), TC=25 °C
ID
80
A
Continuous drain current1), TC=100 °C 50
Pulsed drain current2), TC=25 °C ID, pulse 240 A
Continuous diode forward current1), TC=25 °C IS 80 A
Diode pulsed current2), TC=25 °C IS, pulse 240 A
Power dissipation3) TC=25 °C PD 455 W
Single pulsed avalanche energy5) EAS 1700 mJ
MOSFET dv/dt ruggedness, VDS=0…480 V dv/dt 50 V/ns
Reverse diode dv/dt, VDS=0…480 V, ISD≤ID dv/dt 15 V/ns
Operation and storage temperature Tstg, Tj -55 to 150 °C

Thermal Characteristics
 
Parameter Symbol Value Unit
Thermal resistance, junction-case RθJC 0.27 °C/W
Thermal resistance, junction-ambient4) RθJA 62 °C/W

Electrical Characteristics at Tj=25°C unless otherwise specified
Parameter Symbol Min. Typ. Max. Unit Test condition

Drain-source breakdown voltage

BVDSS
650    
V
VGS=0 V, ID=2 mA
700     VGS=0 V, ID=2 mA, Tj=150 °C
Gate threshold voltage VGS(th) 2.8   4.0 V VDS=VGS, ID=2 mA

Drain-source on- state resistance

RDS(ON)
  0.028 0.035
Ω
VGS=10 V, ID=40 A
  0.075   VGS=10 V, ID=40 A, Tj=150 °C
Gate-source leakage current
IGSS
    100
nA
VGS=30 V
    -100 VGS=-30 V
Drain-source leakage current IDSS     5 μA VDS=650 V, VGS=0 V
Gate resistance RG   2.4   Ω ƒ= 1 MHz, Open drain

Dynamic Characteristics
Parameter Symbol Min. Typ. Max. Unit Test condition
Input capacitance Ciss   7549.2   pF
VGS=0 V, VDS=50 V,
ƒ=100 kHz
Output capacitance Coss   447.1   pF
Reverse transfer capacitance Crss   13.2   pF
Turn-on delay time td(on)   52.3   ns
VGS=10 V, VDS=400 V, RG=5 Ω, ID=40 A
Rise time tr   86.8   ns
Turn-off delay time td(off)   165.2   ns
Fall time tf   8.5   ns

Gate Charge Characteristics
Parameter Symbol Min. Typ. Max. Unit Test condition
Total gate charge Qg   153.6   nC

VGS=10 V, VDS=400 V, ID=40 A
Gate-source charge Qgs   41.8   nC
Gate-drain charge Qgd   50.2   nC
Gate plateau voltage Vplateau   5.8   V

Body Diode Characteristics
Parameter Symbol Min. Typ. Max. Unit Test condition
Diode forward voltage VSD     1.3 V IS=80 A, VGS=0 V
Reverse recovery time trr   566.1   ns VR=400V,
IS=40 A,
di/dt=100 A/μs
Reverse recovery charge Qrr   13.2   μC
Peak reverse recovery current Irrm   45.9   A

Note
  1. Calculated continuous current based on maximum allowable junction temperature.
  2. Repetitive rating; pulse width limited by max. junction temperature.
  3. Pd is based on max. junction temperature, using junction-case thermal resistance.
  4. The value of RθJA is measured with the device mounted on 1 in 2 FR-4 board with 2oz. Copper, in a still air environment with Ta=25 °C.
  5. VDD=100 V, VGS=10 V, L=60 mH, starting Tj=25 °C.
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