Pdfn5X6 Sfs08r024ugf Vds-80 ID-520A RDS (ON) -2.4milliohm Qg-73.8 Nc Switching Mode Power Supply Motor Driver Power Mosfet

• Certification: RoHS, ISO
• Shape: ST
• Shielding Type: Remote Cut-Off Shielding Tube
• Cooling Method: Air Cooled Tube
• Function: Switch Transistor
• Working Frequency: High Frequency
• Model NO.: SFS08R024UGF
• Structure: Diffusion
• Encapsulation Structure: Chip Transistor
• Power Level: High Power
• Material: Silicon
• Transport Package: Air
• Trademark: Orientalsemi
• HS Code: 8541290000
• Production Capacity: Over 1kk/Month

Product Description

General Description
FSMOS®   MOSFET  is  based on Oriental Semiconductor's  unique device design to achieve  low RDS(ON) , low gate charge, fast switching and excellent avalanche characteristics. The low Vth  series is specially optimized for synchronous rectification systems with low driving voltage.




Features
      Low RDS(ON) & FOM
      Extremely low switching loss
      Excellent reliability and uniformity
      Fast switching and soft recovery



Applications
      Switching mode power supply
      Motor driver
      Battery protection
      DC-DC convertor
      Inverter
      UPS



Key Performance Parameters

Parameter	Value	Unit
VDS	80	V
ID, pulse	520	A
RDS(ON), max @ VGS =10V	2.4	mΩ
Qg	73.8	nC

Absolute Maximum Ratings at Tj =25°C unless otherwise noted

Parameter	Symbol	Value	Unit
Drain-source voltage	VDS	80	V
Gate-source voltage	VGS	±20	V
Continuous drain current1) , TC=25 °C	ID	130	A
Pulsed drain current2) , TC=25 °C	ID, pulse	520	A
Continuous diode forward current1) , TC=25 °C	IS	130	A
Diode pulsed current2) , TC=25 °C	IS, pulse	520	A
Power dissipation3), TC=25 °C	PD	132	W
Single pulsed avalanche energy5)	EAS	205	mJ
Operation and storage temperature	Tstg , Tj	-55 to 175	°C

Thermal Characteristics

Parameter	Symbol	Value	Unit
Thermal resistance, junction-case	RθJC	1.14	°C/W
Thermal resistance, junction-ambient4)	RθJA	62	°C/W

Electrical Characteristics at Tj =25°C unless otherwise specified

Parameter	Symbol	Min.	Typ.	Max.	Unit	Test condition
Drain-source          breakdown voltage	BVDSS	80			V	VGS =0 V, ID =250 μA
Gate threshold voltage	VGS(th)	1		2.5	V	VDS =VGS , ID =250 μA
Drain-source on-state resistance	RDS(ON)		2	2.4	mΩ	VGS =10 V, ID=50 A
			2.7	3.5		VGS =4.5 V, ID=50 A
Gate-source leakage current	IGSS			100	nA	VGS =20 V
				- 100		VGS =-20 V
Drain-source leakage current	IDSS			1	uA	VDS =80 V, VGS =0 V
Gate resistance	RG		2.8		Ω	ƒ=1 MHz, Open drain

Dynamic Characteristics

Parameter	Symbol	Min.	Typ.	Max.	Unit	Test condition
Input capacitance	Ciss		4850		pF	VGS =0 V, VDS =25 V, ƒ=100 kHz
Output capacitance	Coss		1950		pF
Reverse transfer capacitance	Crss		116		pF
Turn-on delay time	td(on)		13		ns	VGS =10 V, VDS =40 V, RG=2 Ω, ID=40 A
Rise time	tr		11		ns
Turn-off delay time	td(off)		59		ns
Fall time	tf		22		ns

Gate Charge Characteristics
 

Parameter	Symbol	Min.	Typ.	Max.	Unit	Test condition
Total gate charge	Qg		73.8		nC	VGS =10 V, VDS =40 V, ID=40 A
Gate-source charge	Qgs		12.4		nC
Gate-drain charge	Qgd		12		nC
Gate plateau voltage	Vplateau		3		V

Body Diode Characteristics
 

Parameter	Symbol	Min.	Typ.	Max.	Unit	Test condition
Diode forward voltage	VSD			1.3	V	IS=12 A, VGS =0 V
Reverse recovery time	trr		70		ns	VR=40 V, IS=40 A, di/dt=100 A/μs
Reverse recovery charge	Qrr		66		nC
Peak reverse recovery current	Irrm		1.6		A

Note
1)    Calculated continuous current based on maximum allowable junction temperature.
2)    Repetitive rating; pulse width limited by max. junction temperature.
3)    Pd is based on max. junction temperature, using junction-case thermal resistance.
4)    The value of RθJA  is measured with the device mounted on 1 in2  FR-4 board with 2oz. Copper, in a still air environment with Ta=25 °C.
5)    VDD=50 V,VGS=10 V, L=0.3 mH, starting Tj =25 °C.





 

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