• Pfc Architecture and Control 3-Phase Vienna Topology To247 Osg65r035hf High Voltage Power Mosfet
  • Pfc Architecture and Control 3-Phase Vienna Topology To247 Osg65r035hf High Voltage Power Mosfet
  • Pfc Architecture and Control 3-Phase Vienna Topology To247 Osg65r035hf High Voltage Power Mosfet
  • Pfc Architecture and Control 3-Phase Vienna Topology To247 Osg65r035hf High Voltage Power Mosfet
  • Pfc Architecture and Control 3-Phase Vienna Topology To247 Osg65r035hf High Voltage Power Mosfet
  • Pfc Architecture and Control 3-Phase Vienna Topology To247 Osg65r035hf High Voltage Power Mosfet

Pfc Architecture and Control 3-Phase Vienna Topology To247 Osg65r035hf High Voltage Power Mosfet

Description: Extremely Low Switching Loss
Characteristics: Excellent Stability and Uniformity
Applications: PC Power
Industries: LED Lighting
Type: Fast EV Charging Station
Certification: ISO, TUV, RoHS
Samples:
US$ 10/Piece 1 Piece(Min.Order)
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Basic Info.

Model NO.
OSG65R035HF
Warranty
24 Months
Transport Package
Air
Trademark
Orientalsemiconductor
Origin
China
HS Code
854129000
Production Capacity
20kkkk/Monthly

Product Description

General Description
The GreenMOS® high voltage MOSFET utilizes charge balance technology to achieve outstanding low on-resistance and lower gate charge. It is engineered to minimize conduction loss, provide superior switching performance and robust avalanche capability.
The GreenMOS® Generic series is optimized for extreme switching performance to minimize switching loss. It is tailored for high power density applications to meet the highest efficiency standards.

Features                                                                                                   
  • Low RDS(on) & FOM
  • Extremely low switching loss
  • Excellent stability and uniformity

Applications
  • PC power
  • LED lighting
  • Telecom power
  • Server power
  • EV Charger
  • Solar/UPS
  •  
  • Key Performance Parameters
  •  
    Parameter Value Unit
    VDS, min @ Tj(max) 700 V
    ID, pulse 240 A
    RDS(ON) , max @ VGS=10V 35
    Qg 153.6 nC

    Marking Information
     
    Product Name Package Marking
    OSG65R035HTF TO247 OSG65R035HT
Absolute Maximum Ratings at Tj=25°C unless otherwise noted
 
Parameter Symbol Value Unit
Drain-source voltage VDS 650 V
Gate-source voltage VGS ±30 V
Continuous drain current1), TC=25 °C
ID
80
A
Continuous drain current1), TC=100 °C 50
Pulsed drain current2), TC=25 °C ID, pulse 240 A
Continuous diode forward current1), TC=25 °C IS 80 A
Diode pulsed current2), TC=25 °C IS, pulse 240 A
Power dissipation3) TC=25 °C PD 455 W
Single pulsed avalanche energy5) EAS 1700 mJ
MOSFET dv/dt ruggedness, VDS=0…480 V dv/dt 50 V/ns
Reverse diode dv/dt, VDS=0…480 V, ISD≤ID dv/dt 15 V/ns
Operation and storage temperature Tstg, Tj -55 to 150 °C

Thermal Characteristics
 
Parameter Symbol Value Unit
Thermal resistance, junction-case RθJC 0.27 °C/W
Thermal resistance, junction-ambient4) RθJA 62 °C/W

Electrical Characteristics at Tj=25°C unless otherwise specified
Parameter Symbol Min. Typ. Max. Unit Test condition

Drain-source breakdown voltage

BVDSS
650    
V
VGS=0 V, ID=2 mA
700     VGS=0 V, ID=2 mA, Tj=150 °C
Gate threshold voltage VGS(th) 2.8   4.0 V VDS=VGS, ID=2 mA

Drain-source on- state resistance

RDS(ON)
  0.028 0.035
Ω
VGS=10 V, ID=40 A
  0.075   VGS=10 V, ID=40 A, Tj=150 °C
Gate-source leakage current
IGSS
    100
nA
VGS=30 V
    -100 VGS=-30 V
Drain-source leakage current IDSS     5 μA VDS=650 V, VGS=0 V
Gate resistance RG   2.4   Ω ƒ= 1 MHz, Open drain

Dynamic Characteristics
Parameter Symbol Min. Typ. Max. Unit Test condition
Input capacitance Ciss   7549.2   pF
VGS=0 V, VDS=50 V,
ƒ=100 kHz
Output capacitance Coss   447.1   pF
Reverse transfer capacitance Crss   13.2   pF
Turn-on delay time td(on)   52.3   ns
VGS=10 V, VDS=400 V, RG=5 Ω, ID=40 A
Rise time tr   86.8   ns
Turn-off delay time td(off)   165.2   ns
Fall time tf   8.5   ns

Gate Charge Characteristics
Parameter Symbol Min. Typ. Max. Unit Test condition
Total gate charge Qg   153.6   nC

VGS=10 V, VDS=400 V, ID=40 A
Gate-source charge Qgs   41.8   nC
Gate-drain charge Qgd   50.2   nC
Gate plateau voltage Vplateau   5.8   V

Body Diode Characteristics
Parameter Symbol Min. Typ. Max. Unit Test condition
Diode forward voltage VSD     1.3 V IS=80 A, VGS=0 V
Reverse recovery time trr   566.1   ns VR=400V,
IS=40 A,
di/dt=100 A/μs
Reverse recovery charge Qrr   13.2   μC
Peak reverse recovery current Irrm   45.9   A

Note
  1. Calculated continuous current based on maximum allowable junction temperature.
  2. Repetitive rating; pulse width limited by max. junction temperature.
  3. Pd is based on max. junction temperature, using junction-case thermal resistance.
  4. The value of RθJA is measured with the device mounted on 1 in 2 FR-4 board with 2oz. Copper, in a still air environment with Ta=25 °C.
  5. VDD=100 V, VGS=10 V, L=60 mH, starting Tj=25 °C.
Pfc Architecture and Control 3-Phase Vienna Topology To247 Osg65r035hf High Voltage Power MosfetPfc Architecture and Control 3-Phase Vienna Topology To247 Osg65r035hf High Voltage Power MosfetPfc Architecture and Control 3-Phase Vienna Topology To247 Osg65r035hf High Voltage Power MosfetPfc Architecture and Control 3-Phase Vienna Topology To247 Osg65r035hf High Voltage Power MosfetPfc Architecture and Control 3-Phase Vienna Topology To247 Osg65r035hf High Voltage Power Mosfet

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