Certification: | RoHS, ISO |
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Shape: | ST |
Shielding Type: | Sharp Cutoff Shielding Tube |
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General Description
The GreenMOS® high voltage MOSFET utilizes charge balance technology to achieve outstanding low on-resistance and lower gate charge. It is engineered to minimize conduction loss, provide superior switching performance and robust avalanche capability.Parameter | Value | Unit |
VDS, min @ Tj(max) | 700 | V |
ID, pulse | 12 | A |
RDS(ON) , max @ VGS=10V | 1.4 | Ω |
Qg | 6.7 | nC |
Product Name | Package | Marking |
OSG65R1K4DF | TO252 | OSG65R1K4D |
Parameter | Symbol | Value | Unit |
Drain-source voltage | VDS | 650 | V |
Gate-source voltage | VGS | ±30 | V |
Continuous drain current1), TC=25 °C | ID |
4 | A |
Continuous drain current1), TC=100 °C | 2.5 | ||
Pulsed drain current2), TC=25 °C | ID, pulse | 12 | A |
Continuous diode forward current1), TC=25 °C | IS | 4 | A |
Diode pulsed current2), TC=25 °C | IS, pulse | 12 | A |
Power dissipation3), TC=25 °C | PD | 28.4 | W |
Single pulsed avalanche energy5) | EAS | 112 | mJ |
MOSFET dv/dt ruggedness, VDS=0…480 V | dv/dt | 50 | V/ns |
Reverse diode dv/dt, VDS=0…480 V, ISD≤ID | dv/dt | 15 | V/ns |
Operation and storage temperature | Tstg, Tj | -55 to 150 | °C |
Parameter | Symbol | Value | Unit |
Thermal resistance, junction-case | RθJC | 4.4 | °C/W |
Thermal resistance, junction-ambient4) | RθJA | 62 | °C/W |
Parameter | Symbol | Min. | Typ. | Max. | Unit | Test condition |
Drain-source breakdown voltage |
BVDSS |
650 | V |
VGS=0 V, ID=250 μA | ||
700 | 770 | VGS=0 V, ID=250 μA, Tj=150 °C | ||||
Gate threshold voltage |
VGS(th) | 2.0 | 4.0 | V | VDS=VGS, ID=250 μA | |
Drain-source on- state resistance |
RDS(ON) |
1.2 | 1.4 | Ω |
VGS=10 V, ID=2 A | |
2.9 | VGS=10 V, ID=2 A, Tj=150 °C | |||||
Gate-source leakage current | IGSS |
100 | nA |
VGS=30 V | ||
-100 | VGS=-30 V | |||||
Drain-source leakage current | IDSS | 1 | μA | VDS=650 V, VGS=0 V |
Parameter | Symbol | Min. | Typ. | Max. | Unit | Test condition |
Input capacitance | Ciss | 259.9 | pF | VGS=0 V, VDS=50 V, ƒ=1 MHz |
||
Output capacitance | Coss | 21.1 | pF | |||
Reverse transfer capacitance | Crss | 0.9 | pF | |||
Turn-on delay time | td(on) | 30.9 | ns | VGS=10 V, VDS=380 V, RG=25 Ω, ID=4 A |
||
Rise time | tr | 20.7 | ns | |||
Turn-off delay time | td(off) | 56.3 | ns | |||
Fall time | tf | 28.7 | ns |
Parameter | Symbol | Min. | Typ. | Max. | Unit | Test condition |
Total gate charge | Qg | 6.7 | nC | VGS=10 V, VDS=400 V, ID=4 A |
||
Gate-source charge | Qgs | 1.5 | nC | |||
Gate-drain charge | Qgd | 3.2 | nC | |||
Gate plateau voltage | Vplateau | 6.4 | V |
Parameter | Symbol | Min. | Typ. | Max. | Unit | Test condition |
Diode forward voltage | VSD | 1.3 | V | IS=4 A, VGS=0 V | ||
Reverse recovery time | trr | 162 | ns | VR=400 V, IS=4 A, di/dt=100 A/μs |
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Reverse recovery charge | Qrr | 1.2 | μC | |||
Peak reverse recovery current | Irrm | 7 | A |